Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems
DIYALA JOURNAL OF ENGINEERING SCIENCES,
Volume 11, Issue 1, Pages 38-43
AbstractA novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature.
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